SUNDELL Technology Co., Ltd.

ดูรายละเอียดบริษัท

HDI Process Engineer

8 ส.ค. 69

สถานที่ปฏิบัติงาน

อ.อุทัย จ.พระนครศรีอยุธยา

เงินเดือน

ตามตกลง

อัตรา

รับเฉพาะใบสมัครภาษาอังกฤษเท่านั้น

สมัครงาน

สนใจ

แชร์

รายละเอียดงาน

1. Responsible for HDI PCB manufacturing processes, including Laser Drilling, Via Fill Plating, Sequential Lamination, and Any-layer HDI Technology. 2. Develop, optimize, and control process parameters to ensure stable production performance, high yield, and product quality. 3. Analyze and troubleshoot process-related issues, including Via Void, Via Crack, Copper Filling Defects, Delamination, Registration Issues, and Reliability Failures. 4. Support the development and mass production of advanced HDI products, including Any-layer HDI, Stacked Via, and Build-up Structures. 5. Drive continuous improvement initiatives to enhance yield, reduce defects, improve productivity, and lower manufacturing costs. 6. Establish and maintain process documentation, SOPs, work instructions, and control plans. 7. Collaborate with Production, Quality, CAM, Engineering, and NPI teams to support new product introduction and process qualification. 8. Conduct root cause analysis using engineering methodologies such as 8D, 5 Why, FMEA, SPC, and DOE. 9. Support customer audits, technical reviews, and reliability improvement projects.

คุณสมบัติผู้สมัคร

Bachelor's Degree or above in Electronics Engineering, Electrical Engineering, Materials Engineering, Chemical Engineering, or related fields.
Minimum 6 years of experience in HDI PCB manufacturing or process engineering.
Strong hands-on experience in Laser Drill, Via Fill Plating, Sequential Lamination, Any-layer HDI, and Stacked Via technologies.
Solid understanding of HDI PCB structures, Build-up Technology, Copper Filling Processes, and Reliability Requirements.
Strong troubleshooting and problem-solving skills in advanced PCB manufacturing processes.
Familiar with IPC standards, process control methodologies, and statistical analysis tools.
Good command of Chinese and English, both written and spoken.
Experience in Smartphone, AI Server, High-Performance Computing (HPC), Automotive PCB, or IC Substrate manufacturing is highly preferred.
Experience with Any-layer HDI, 2+N+2, 3+N+3, or higher-layer HDI structures.
Knowledge of SPC, DOE, FMEA, Six Sigma, and Lean Manufacturing methodologies.
Experience leading process improvement projects and cross-functional engineering teams.
Ability to work in a fast-paced manufacturing environment and support advanced technology development.